Here you will find explanations and definitions of technical terms.
The so-called color shift is a change in the color temperature of an LED as a result of direct wetting of the chip with, for example, a casting resin. Due to a boundary layer change at the exit point of the light, a color change results. There are various ways of counteracting this effect: calculating the shift in the end product, avoiding direct wetting, counteracting drift, and others.
The multitude of different PCBs, from rigid to flexible, can hardly be summarized. All manufacturers have different heat generation and therefore require heat management tailored to themselves. Whether hotspot, full-area or sophisticated heat spreading - the right heat conduction determines the longevity of your products. Finding the balancing act between necessity and oversizing is our claim.
Products very rarely consist of just one component - normally dozens of materials come together that are ultimately encapsulated. Even the printed circuit board usually has many different materials (flux, solder, etc.), plus cables (sheathing, etc.), carrier tracks and sealants. In order to produce a homogeneous product, the components must be coordinated with each other. Boundary relationships, the result of which can be chemical reactions, frequently occur - but only at the customer's site. Expert coordination of all components is not only important, but elementary. Translated with www.DeepL.com/Translator (free version)
Exothermy refers to the heat generated during exothermic chemical reactions. This usually includes 2-component (2K) casting resin systems. Here, two chemical substances react to form a new substance without adding any energy. (Polyaddition of polyol + isocyanate = polyurethane) The temperature also results, among other things, from the quantity of components brought together at the same time. It is important to determine this temperature before designing products. Most common epoxies, for example, have a temperature that can already damage components such as solder paste. Polyurethanes, on the other hand, usually react at <80°C. Translated with www.DeepL.com/Translator (free version)
Coefficient of thermal expansion
All materials have a specific coefficient of expansion with temperature change. This should be known - for all components used - and coordinated with each other. A plastic material, for example, can have an expansion value that is 10 times higher than that of aluminum. This leads to stresses, stresses lead to cracks, and cracks lead to moisture damage. IP68 is different!
...and much more!
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